Electronics Failure Analysis: Failure Analysis (FA) testing on electronics is a common technique that utilizes a FLIR thermal camera to visualize and identify anomalies on small Integrated Circuits and PCB’s down to 3.5um spot sizes. This non contact, high resolution testing at a few micron spot sizes allows you to reduce testing times and improve designs during the product development cycle.
Electronics Failure Analysis Video Gallery
Electronics Failure Analysis Image Gallery
FLIR Infrared Cameras for Electronics Failure Analysis Applications
Entry Level Products
FLIR A655sc IR Camera
An Uncooled detector, high resolution, and all of the cutting-edge functionality the A655sc brings affordable research and science thermal imaging and measurement to a whole new level.
High definition MWIR imagery from a highly sensitive cooled InSb detector, the sc8000 Series provides superb resolution, and lightning fast frame and data rates for extreme imaging flexibility and data capture capability.